Igraphite Micro powder

1. Undoqo weMveliso

Igraphite Micro powder yimathiriyeli yomgubo wegraphite elungiswe ukusuka phezulu{0}}kubusulungeke bendalo begraphite okanye igraphite eyenziweyo ngeenkqubo ezichanekileyo ezinje ngokutyumza, ukuhlelwa, kunye nokucoca. Ixabiso layo elingundoqo lilele ekwandiseni iingenelo ze-graphite's layered crystal structure ngokusebenzisa i-microparticle size optimization, edibanisa i-conductivity egqwesileyo, i-lubricity, ukumelana nobushushu obuphezulu, kunye nokuzinza kweekhemikhali, kwaye inokwanelisa imfuno "yokucokisa kunye nokusebenza" kwezinto zomgubo kwiindawo eziphezulu ze-{2} zokugqibela.

2. IiParameters ezingundoqo zobuGcisa

3.Iimpawu eziphambili zeMveliso

1

Ubungakanani be-particle (D50) bunokulawulwa ngaphakathi kwe-1-10 μm (i-customizable ukuya kwi-100nm-5 μm i-ultrafine specitions), kunye ne-particle encinci yokusabalalisa ubungakanani be-span (I-Span Ngaphantsi okanye ilingana ne-0.8), akukho nto ye-agglomeration, kwaye kulula ukusabalalisa ngokulinganayo kwimveliso ehambelanayo yokusebenza kwe-matrix.

(2) Ukucoceka okuphezulu kunye nokungcola okuphantsi

I-graphite Micro powder inomxholo wekhabhoni osisigxina we-99.5% (eneenkcazo eziphezulu ze-{1}} ezibonisa umxholo wekhabhoni oqingqiweyo we-Greater than or equal to 99.95%) kunye ne-ash content Ngaphantsi okanye ilingana ne-0.5% (kunye neenkcukacha ze-ultrafine ezibonisa i-ash content okanye i-0. Ayinabumdaka obunobungozi obufana nesulfure kunye ne-phosphorus, ukwenzela ukuba kuthintelwe ungcoliseko kwiimeko zesicelo okanye ukuphazamiseka kokusebenza kwazo.

(3) IiPropati ezigqwesileyo zeMzimba kunye nezeMichiza

I-Conductivity: Ukumelana nomthamo Ngaphantsi okanye ilingana ne-10 Ω·cm, ingasetyenziswa njengesizalisi sokuqhuba ukunyusa ukuhanjiswa kwezinto;

Ukuthambisa: Ubunzima be-Mohs 1{2}}2, i-friction coefficient Ngaphantsi okanye ilingana ne-0.15, inokutshintsha izithambisi zetsimbi kwiimeko zokuthambisa i-oyile-free;

Ukumelana nokushisa okuphezulu: Iyakwazi ukumelana namaqondo okushisa ngaphezu kwe-3000℃kwigesi ye-inert, ayinyibiliki okanye i-oxidize, kwaye ine-coefficient ephantsi yokwandiswa kwe-thermal (2-5 × 10⁻⁶/ degree);

Uzinzo lweMichiza: Ukumelana ne-asidi, i-alkali, kunye ne-organic solvent corrosion, izinzile kwi-pH 2-12 imo, kwaye ayisebenzi kwizinto ezininzi zeekhemikhali.

(4) Ukulungelelaniswa koMsebenzi oLungileyo

I-powder ine-flowability enhle (i-angle yokuphumla Ngaphantsi okanye ilingana ne-35 degree), kulula ukuxuba kunye ne-substrates ezifana ne-resin, i-rubber, i-powder yensimbi, njl., kwaye ayonakalisi isakhiwo sokuqala se-substrate. Inokucutshungulwa ngokwahlukeneyo ngeenkqubo ezinje ngoxinzelelo lokubumba, ukubumba inaliti, kunye nokwaleka.

 

 

4. IiNdawo zeSicelo eziPhambili

(1) Ishishini lokuthambisa

Njenge-lubricant eyomileyo eyongeziweyo kumacandelo omatshini afana neebheringi, iigiya, iivalve;

Ukulungisa izinto zokuthambisa eziqinileyo (umzekelo, ukuthambisa izixhobo zamandla omoya, iinxalenye ze-aerospace);

Isetyenziswa njenge-oyile yokuthambisa / isongezo segrisi ukuphucula ubomi bokuthambisa kunye nokuqhelana neemeko zokusebenza ezigqithisileyo.

(2) Icandelo elitsha lezaMandla

Ibhetri yeLithium negative electrode conductive agent: Iphucula ukusebenza kwemathiriyeli ye-electrode engakhiyo (umzekelo, igraphite, isilicon{2}izinto ezisekwe), inciphisa ukunganyangeki kwangaphakathi kwebhetri, yongeza intlawulo{3}}ukukhupha ukusebenza kakuhle kunye nobomi bomjikelezo;

I-fuel cell bipolar plate coating: Yandisa i-conductivity kunye ne-corrosion resistance ye-bipolar plates, inciphisa ukuxhathisa ukudibanisa.

(3) Iingubo kunye ne-Ink Industry

Iiconductive coatings: Isetyenziselwa i-anti{0}}flooring engatshintshiyo, i-electromagnetic shielding coatings, i-electronic component iqokobhe iingubo zokugquma;

I-coating ephezulu yokumelana nobushushu: Isetyenziselwa ukugquma iindonga zangaphakathi zeebhoyila kunye neekhilni ukunyusa ukumelana nobushushu obuphezulu kunye nokumelana nokunxiba;

I-inki ekhethekileyo: Ilungisa i-inki eqhubayo (umzekelo, iisekethe ze-elektroniki eziguquguqukayo, iithegi zeRFID) ukuqinisekisa ukuhanjiswa okuzinzileyo emva koshicilelo lwe-inki.

(4) I-Metallurgy kunye ne-Refractory Materials

I-Metallurgical protective slag: Yenza ifilimu ye-slag yamanzi ngexesha lokuphosa ngokuqhubekayo, ihlukanisa umoya, i-lubricate i-billet, kwaye inciphisa iziphene zomhlaba;

Izitena ezilahlayo/izaleko ezilahlayo: Iphucula ukuxhathisa ubushushu obuphezulu kunye nokuxhathisa ukothuka kwe-thermal kwezixhobo ezichasayo, ezisetyenziswa kwizixhobo zobushushu eziphezulu ezifana nentsimbi kunye neekilni zeglasi.

(5) I-Electronics kunye ne-Precision Manufacturing

Izinto zokupakisha ze-elektroniki: Zongezwa njenge-thermal / conductive fillers kwi-epoxy resin packaging agents ukuze kuphuculwe ukusebenza kakuhle kokushisa ubushushu be-chip;

Ukupholisha okuchanekileyo: Isetyenziselwa ukupolisha okucokisekileyo kwee-wafers ze-silicon ze-semiconductor kunye neglasi yokukhanya, ukunciphisa uburhabaxa bomphezulu (ukuya kuthi ga kwi-Ra Ngaphantsi okanye ilingane ne-0.01 μm).

Iifayile ezishisayo: Graphite Micro powder, China Graphite Micro abavelisi umgubo