1. Undoqo weMveliso

I-Braided Graphite Packing, imveliso yegraphite esebenzayo eyenziwe kusetyenziswa -ubusulungeke obuphezulu be-flake ye-graphite yendalo (okanye igraphite eyenziweyo) enomxholo wekhabhoni oMkhulu kuno okanye olingana ne-99.8% njenge-substrate. Umsonto -ophezulu wemodulus carbon fiber (ekubhekiswa kuwo "njengomsonto wekhabhoni") udityaniswe kuxinzelelo oluphambili{4}}iindawo ezithwele kwiikona zemveliso. Inkqubo yokuvelisa ilandelayo:ukunyanzeliswa kwesubstrate ukubumba → umsonto wekhabhoni prepreg ukubopha → phezulu{0}}ubushushu obunyanga → ukusika ngokuchanekileyo. Ixabiso layo eliphambili liku:

Ukugcina iimpawu zemvelo zegraphite: ukuchasana nobushushu obugqithisileyo, ukuxhathisa okuqinileyo kwe-corrosion, kunye ne-thermal / conductivity ephezulu yombane;

Ukusombulula iintlungu zegraphite yesintu enyulu{0}}ukuqhawuka lula kwikona kunye nokunganyangeki kakuhle kweenyembezingexesha lokuphatha, ufakelo, kunye nokusebenza okuguquguqukayo{0}}ngomsonto wekhabhoni{1}}ulwakhiwo lwekona eyomeleziweyo;

Ukuhlangabezana neemfuno zeemeko zoshishino kunye neemfuno eziphezulu zokuthembeka kwesakhiwo.

2. IiParameters zobuGcisa

Iimpawu ze-3.Core

Ukucoceka okuphezulu {{0}okuPhezulu kunye nokuCoceka

I-substrate inomxholo wekhabhoni oMkhulu okanye olingana no-99.8%, umxholo wothuthu oNgaphantsi okanye olingana no-0.2%, umxholo wesulfure oNgaphantsi okanye olingana no-200ppm, kunye nomxholo we-chlorine oNgaphantsi okanye olingana no-30ppm. Ayiqulathanga izongezo (umzekelo, iiresis, ukungcola kwesinyithi) kwaye ithobela imigangatho yemigangatho yokutya ({7}}imigangatho yebakala (i-FDA 21 CFR iSigaba 177.2600) kunye neemfuno zococeko kushishino lwesemiconductor. Ilungele iimeko ezifuna ukungabikho kokungcoliseka kongcoliseko (umz., amayeza, amashishini ombane).

Ukusebenza okugqwesileyo kweKona

Iikona zidityaniswe ne-12K/24K ephezulu{2}}imodulus carbon fiber yarn (tensile modulus Enkulu kuno okanye ilingana ne 230GPa) ngendlela yokuluka itwill + epoxy resin prepreg process. Oku kwandisa ukuxhathisa kwikona yemveliso ngeenyembezi ngama-40%–60% (iikona zegrafu ezisulungekileyo zemveli zine ~8MPa ukuxhathisa kokukrazuka; le mveliso ifikelela kwi-12–13MPa) kwaye yehlisa izinga lomonakalo wekona ukusuka kwi-25% ukuya<3% during handling and installation.

Unyamezelo olugqithisileyo lokusiNgqongileyo

Uluhlu lweqondo lokushisa: -200℃ukuya kwi-600℃(atmosphere yomoya, akukho ukulahleka kwesisindo se-oxidative); -200℃ukuya kwi-3000℃(i-inert atmosphere, umzekelo, i-nitrogen / argon);

Imelana noxinzelelo olumileyo

Emva kweyure ezingama-72 -ukuntywiliselwa kwi-asidi{4}}kwizisombululo ezisisiseko (pH 0–14), umphunga wobushushu obuphezulu, okanye izinyibilikisi zendalo, ukuthotywa kokusebenza kuNgaphantsi okanye kuyalingana ne-5%.

IiPropati zoomatshini ezilungelelanisiweyo kunye neziSebenzayo

Amandla omatshini: Amandla e-Flexural Amandla amakhulu okanye alingana ne-25MPa (i-20% ephezulu kune-graphite ecocekileyo yendabuko), amandla acinezelayo Amakhulu okanye alingana ne-40MPa, i-elongation ngekhefu Inkulu okanye ilingana ne-1.2%;

Ugcino olusebenzayo: Igcina i-graphite ecocekileyo ye-thermal conductivity ephezulu ({0}}kwi-plane ye-thermal conductivity Enkulu okanye ilingana ne-150W/m·K) kunye nokuhanjiswa kombane okuphezulu (i-volume resistivity Ngaphantsi okanye ilingana ne-15μΩ·cm), ukulinganisa amandla olwakhiwo kunye neemfuno zokusebenza.

Ukuziqhelanisa nobuNjineli obunamandla

Imilinganiselo eqhelekileyo: Ukutyeba 0.5–5mm, ubude/ububanzi 50–1000mm (ubukhulu obukhethekileyo{4}}bubume obukhona);

Ububanzi bokugubungela umsonto wekhabhoni kwiikona: 5–20mm (ukulungiswa ngokwemfuno);

Ixhasa i-adhesive{0}}backed (adhesive acrylic/silicone{1}based adhesive) okanye-izinto zokuncamathelisa; inokusikwa ngokuthe ngqo ngexesha lofakelo, ukufaka izixhobo ezingaqhelekanga (umzekelo, ezikhethekileyo{5}}iiflange ezimile, imigangatho egobileyo yokutywina).

 

 

4. Iinkalo zeSicelo

(1) IiNkqubo zokutywinwa koShishino

Izixhobo zeMichiza: Ukutywinwa kwe-asidi{0}isiseko seeketile zokuphendula, ukutywinwa kwe-shaft kubushushu obuphezulu bempompo zodluliselo oluphakathi. Ukwandisa ukuxhathisa umhlwa kunye nokumelana nokukrazula kwekona ukusombulula ukungaphumeleli kwetywina okubangelwa ukutshixwa kwekona yeegaskiti zegraphite zemveli ngexesha lokuqhaqha / ukudityaniswa; yandisa ubomi benkonzo yetywina ukuya kwiiyure ezingama-8,000–10,000.

Izixhobo ezitsha zaMandla: Ukutywinwa komphetho kwiipleyiti ze-bipolar kwi-electrolyzers ye-hydrogen, ukutywinwa komnyango kwii-ovens zokomisa ibhetri ye-lithium. Iikona zomsonto wekhabhoni zimelana neempembelelo zoomatshini ezivela rhoqo ekuvulekeni/ekuvaleni kocango, ngelixa zihlangabezana neemfuno ezisezantsi zokungcola (umxholo we-ion wesinyithi Ngaphantsi okanye ukulingana ne-1ppm) ukuqinisekisa ukucoceka kwe-electrolyte.

(2)-IziXhobo zoBubushushu obuPhezulu

Ukuveliswa kwePhotovoltaic: Amacandelo e-Edge afakwa kwi-thermal kwindawo enye{0}}eyikristale yobushushu enye. Imelana nobushushu obuphezulu be-1,600; Iikona zomsonto wekhabhoni zinqanda ukuqhekeka komphetho ukusuka ekwandeni/ukuncipha kwe-thermal, ukwandisa imijikelo yosetyenziso olunye ukusuka kwiiyure eziyi-1,500 ukuya kwiiyure ezingama-2,200.

Ishishini leMetallurgical: I-gaskets yokufakelwa kwe-thermal yeprofayili ye-aluminium extrusion iyafa. Imelana nobushushu obuphezulu obungama-450 kunye ne-aluminiyam engamanzi umhlwa; iikona eziqinisiweyo zithintela umonakalo ngexesha lokuchithwa / ukudibanisa, ukunciphisa iindleko zokutshintshwa kwezinto ezidliwayo ngama-30%.

(3) I-Electronics & Semiconductor Field

IsiXhobo saMandla sokuTyelwa kobushushu: I-gaskets ye-thermal conductive phakathi kweemodyuli ze-IGBT kunye nokushisa okutshisayo. I-conductivity ephezulu ye-thermal iqinisekisa ukuhanjiswa kobushushu; iikona zomsonto wekhabhoni zinqanda ukonakala komatshini ngexesha lofakelo, ukuziqhelanisa ne{1}}isantya esiphezulu sokukhetha{2}}kunye{3}}ne{3}}iimfuno zendawo yemigca yokudityaniswa ezenzekelayo.

Izixhobo zokucoca iSemiconductor: Izitywina zamatanki okucoca iwafa. Ixhathisa i-asidi eqinile (umzekelo, isisombululo se-HF); ukucoceka kuhambelana nemigangatho ye-SEMICON F47, ukuthintela ukungcoliseka kokungcola kwiindawo ezinqabileyo.

(4) Inkalo yobuNjineli obukhethekileyo

I-Aerospace: Ubushushu obuphantsi-ukutywinwa kweenkqubo zokuqhubela phambili kwesiphekepheke ({3}}196 isidanga solwelo senitrogen yokusingqongileyo). Umsonto wekhabhoni{4}}izakhiwo ezomeleziweyo ziphucula okusezantsi{5}}ubushushu bokuchasana nokuqhekeka kokusebenza, ukuqinisekisa ukuthembeka kokutywinwa phantsi kobushushu obugqithisileyo.

Ishishini leNyukliya: Ukutywinwa kwimibhobho encedisayo kwiinkqubo zokupholisa zereactor yenyukliya. Ixhathisa ukusasazeka kwemitha ( -ithamo lemitha Ngaphantsi okanye ilingana ne-10⁶Gy) kunye namaqondo angama-350 aphezulu; Amandla ekona adibana{4}}neemfuno zenkonzo yexesha elide, ukunciphisa ukugcinwa rhoqo.

5. Amanqaku abongezelelweyo

Iinkonzo zokuLungisa: Uhlobo lomsonto weCarbon (umzekelo, umsonto we-thermal conductivity ophezulu we-carbon fiber), uluhlu lokugubungela ikona, kunye nemilinganiselo yemveliso inokulungelelaniswa ngokweemfuno zomthengi. Izakheko ezikhethekileyo-ezimile (umzekelo, isetyhula,{6}}ezimileyo) ziyaxhaswa, kunye nobukhulu obuncinci besiko obuyi-0.3mm.

Iziqinisekiso zoMgangatho: Imveliso idlulise isatifikethi se-ISO 9001 yoLawulo loMgangatho weSistim, uvavanyo lwe-SGS yokusingqongileyo (i-RoHS 2.0), kunye ne-SEMICON F47 isiqinisekiso sococeko se-semiconductor. Iingxelo zovavanyo lomntu wesithathu ziyafumaneka xa ziceliwe.

Iingcebiso zoFakelo:

Ngethuba lokufakwa kwe-Braided Graphite Packing, ukudibanisa ngokuthe ngqo phakathi kwezixhobo ezibukhali kunye neekona zekhabhoni zayo kufuneka zigwenywe; imichilo ye-silicone yoxinzelelo inconywa ukulungiswa kokuncedisa.Kwizicelo zobushushu obuphezulu-, ukufudumeza kwangaphambili kwi-200℃iiyure ezi-2 kucetyiswa ukunciphisa ukuguquka kwe-thermal.

Iifayile ezishisayo: Ukupakishwa kweGraphite ephothiweyo, iChina ephothiweyo abavelisi beGraphite yokuPakisha